Semi-flexible circuit boards

In contrast to rigid plates, semi-flexibles are bendable at pre-determined points. To achieve this a special flex-(solder-stop) lacquer in applied to the required points instead of the usual solder-stop lacquer. These points are then ground to a defined depth at which the material is elastic and bendable. It should be noted that in contrast to flexi-boards the bending cycles and bending angles are more restricted. This method is particularly suitable for double-sided boards and multi-layers.

EXECUTION

  • semi-flexibel

BASIS MATERIAL

  • FR4 TG 135°-140° (Standard)
  • FR4 CTI 175-249 (Standard)
  • FR4 TG 150°
  • FR4 CTI 400
  • FR4 CTI 500
  • FR4 CTI 600
  • FR4 halogenfrei
  • FR4 CAF-beständig
  • CEM1
  • CEM3

CIRCUIT BOARD STRENGTH

  • 0,5 mm bis 3,2 mm

SURFACES

  • Heissluftverzinnt bleifrei (HAL bleifrei)
  • Chemisch Nickel-Gold (NiAu oder ENIG)
  • Chemisch Zinn (Chem.Sn)
  • Chemisch Silber (Chem.Ag)
  • Galvanische Hart-/Steckervergoldung
  • OSP (Organic Surface Protection)

FINAL COPPER STRENGTH

  • Endkupferstärke 18 µ bis 140 µ
  • Endkupferstärke in den Durchkontaktierungen ca. 20 µ -25 µ (Standard)
  • Endkupferstärke in den Durchkontaktierungen > 25 µ (nach IPC A600 Klasse 3)

SOLDERMASK

  • grün (Standard)
  • weiß
  • schwarz
  • rot
  • blau

MINIMUM FINAL DRILLING DIAMETER

  • 0,10 mm

MINIMUM STRUCTURE (CONDUCTOR PATH/ISOLATION WIDTH)

  • ≥ 75 µ

CONTOUR PROCESSING

  • Fräsen
  • Ritzen
  • Fasen

ADDITIONAL PRINTS

  • Kennzeichnungsdruck (einseitig, beidseitig)
  • Via-Plugging
  • Carbon
  • Abziehlack
  • Captonband
  • Flexibler Lötstopplack (grün)

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