In contrast to one- and double-sided circuit boards, multilayer boards have additional internal layers. These are made of copper foil, prepregs and fine copper-clad laminates. Through-bonding connects the layers enabling greater, and denser circuit structures over several levels. Both micro vias (drillings with minute diameters) as well as blind-via drillings are possible.
Microcirtec manufactures multilayers with up to 24 layers. Their stack-up depends on the number of layers and how they are connected to each other. The combination possibilities here are practically unlimited as you can choose from a numerous number of prepregs (fibre-glass mats impregnated with phenolic resin) and cores to suit your requirements. It is, therefore, impossible here to describe all layer stack-ups with their endless design possibilities.
Some of the most frequently used stack-ups (standard stack-ups), as well as some specially constructed stack-ups can be found on the right in PDF downloads. All other stack-ups are always available through our technical support.